Electronic Liquid Cooling Systems
Özet
This study by İsmet Faruk YAKA and Afşin GÜNGÖR examines electronic liquid cooling systems and thermal energy management methods for modern electronic devices. Electronic cooling systems are broadly categorized into four primary types: air cooling, liquid cooling, thermosiphon, and thermoelectric cooling. Liquid cooling is further divided into direct (immersion) systems, where dielectric fluid directly contacts electronic components, and indirect systems, which transfer heat through cold plates and closed loops equipped with expansion tanks. Heat sink applications primarily rely on cold plates—such as Formed Tube, Deep Drilled, Machined Channel, and Pocketed Folded-Fin types—and microchannel heat sinks (MCHS), which offer high heat transfer surface area suitable for compact designs. System performance can be improved by optimizing heat sink design and using high-performance cooling fluids. Reducing hydraulic diameter enhances heat transfer via Nusselt and Reynolds numbers, though channel count and geometry (such as spiderweb topology) must balance thermal efficiency against pressure drop. Furthermore, incorporating nanofluids (such as metal oxide or carbon-based nanoparticles) enhances thermal cooling performance by an average of 4–12%, despite challenges regarding dispersion stability, viscosity, pumping power, and cost. Ultimately, advancing microchannel designs and nanofluids leads to lower energy consumption and sustainable thermal management.
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